High Temperature Applications

Additive free bonding for harsh environments

High Temperature Applications

High temperatures are challenging to handle. Commonly used additives and solder materials can cause issues when temperature cycling. Primoceler offers a totally new concept for robust packaging. Many challenges can be avoided when using only one packaging material.

Key benefits

  • Only one material in the package ›› CTE issues avoided
  • No additives ›› Outgassing avoided

Processing at high temperatures

Processes at high temperature has been challenging to control. Measurement devices can be damaged due to high heat. For example applications in oil and gas industry, engines for automotive and aerospace have high temperature environments. And all have situations where reliable measurements are valuable. In addition, many electronics manufacturing processes use high temperature conditions. Processes like physical vapor deposition (PVD), chemical vapor deposition (CVD) and epitaxy rely on precise process and temperature control.

Controlling processes everywhere

Primoceler helps designing and manufacturing devices for harsh environments. Lack of additive materials avoids out-gassing issues. In addition, the device can be packaged completely in glass. For this, challenges due to different Coefficient of Thermal Expansions (CTE) are minimised. Quartz glasses have good thermal properties. Primoceler’s bonding technology is perfect for bonding quartz glass.


Proven reliability

Primoceler’s glass micro bonding technology is well tested. We have experience from aerospace applications with the European Space Acengy (ESA). Our technology has also been tested at Technical Research Centre of Finland(VTT).




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